![China Micro Communications Equipment HDI PCB Assembly Used BGA PCB Assembly or Fine Pitch Placement Advanced PCBA Board Technologies and PCB Assembly Quotation for sale](http://img1.b2bforus.com/46/43/8c5fd442306a/product/131234469_s-w400xh400.jpg)
Micro Communications Equipment HDI PCB Assembly Used BGA PCB Assembly or Fine Pitch Placement Advanced PCBA Board Technologies and PCB Assembly Quotation
Price: Negotiable
MOQ: 1.0 piece
Delivery Time: Negotiable
Brand: Hemeixin
➤ Visit Website
![China Communications Equipment Advanced Fine Pitch Part Placement PCBA Technologies Used Of BGA PCB Assembly With X-Ray Inspection And Low Cost PCB Assembly for sale](http://img1.b2bforus.com/46/43/8c5fd442306a/product/131234826_s-w400xh400.jpg)
Communications Equipment Advanced Fine Pitch Part Placement PCBA Technologies Used Of BGA PCB Assembly With X-Ray Inspection And Low Cost PCB Assembly
Price: Negotiable
MOQ: 1.0 piece
Delivery Time: Negotiable
Brand: Hemeixin
➤ Visit Website